Capabilities

Feature Sizes

Single Sided (inch)

Double Sided (inch)

Multilayer (inch)

Min

Pref

Min

Pref

Min

Pref

Min. Track Width

0.006

0.008

0.004

0.008

0.004

0.008

Track To Track Spacing

0.006

0.008

0.004

0.008

0.004

0.008

Min. Drill Size

0.010

0.020

0.008

0.020

0.008

0.020

Min. Annular Ring

0.006

0.010

0.006

0.010

0.010

0.012

Bare Board Test (Flying Probe)

0.006

0.006

0.006

Router Tolerance

0.010

0.010

0.010

Note: Specifications quoted for 35µm (1oz) copper and 1.6mm substrate thickness. Where the finished copper is > 1oz, the minimum track width and clearance must be increased by 6 thou to ensure tracks are not etched off the panel during the production process.

Surface Finish

Single Sided

Double Sided

Multilayer

Hot Air Solder Leveling (HASL)

Yes

Yes

Yes

Lead free HASL

Yes

Yes

Yes

Electroless Nickel Imersion Gold (ENIG)

Yes

Yes

Yes

Hard Gold

Yes

Yes

Yes

Soft Gold

Yes

Yes

Yes

Carbon Ink

Yes

Yes

Yes

Peelable Solder Mask

Yes

Yes

Yes

 

Multilayer

Internal Core

Prepreg

Min. Finish Thickness

4 Layer

0.36mm

0.2mm

0.76mm

6 Layer

0.36mm

0.2mm

1.16mm

8 Layer

0.36mm

0.2mm

1.56mm

10 Layer

0.36mm

0.2mm

1.96mm

Note: Smaller internal cores and prepreg are available at additional charge.

Multilayer Capabilities

B.E.C. can reliably manufacture up to 10 layer FR4 circuit boards at competitive prices. We also offer mixed board multilayer panels to ensure your prototyping costs are kept to a minimum. B.E.C. can manufacture buried via/blind via circuit boards with capabilities to produce 4 thou (0.1mm) track and space. To compliment B.E.C. services all multilayer circuit boards are 100% bare board tested to ensure your assembly and test is trouble free. For further information please contact our Sales Team.

Substrates

B.E.C. can manufacture circuit boards using FR4 as the standard material which is available in various thicknesses. Other materials available for use include Teflon. All materials are readily available and our Sales Team would be happy to assist you with your enquiry. Multilayer substrate is constructed using either 0.1mm or 0.2mm pre-preg FR4 and can be constructed to manufacture any thickness board you require. B.E.C. uses stainless steel to manufacture chemical etch solder stencils. These can also be mounted in the frame size you require. For all stencil pricing please contact our Sales team. If you have something that is not listed in our capabilities, please contact our R&D Department.

Service

Product

3 Day Turnaround

5 Day Turnaround

Med/Large Vol.

Single Sided

Yes

Yes

Yes

Double Sided

Yes

Yes

Yes

Multilayer <10L

No

Yes

Yes

Multilayer >10L

No

7 days

Yes

Blind/Buried Vias

No

No

Yes

Flexibles

No

No

Yes

RF/Teflon

No

No

Yes

Stencils

No

Yes

Yes

Flying Probe Test

Yes

Yes

Yes

Grid Array Test

Yes

Yes

Yes